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| The '''thermal design power''' ('''TDP'''), sometimes called '''thermal design point''', refers to the maximum amount of [[heat]] generated by the [[CPU]], which the [[computer cooling|cooling system]] in a computer is required to [[dissipation|dissipate]].<ref>{{cite web
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| | url = http://www.silentpcreview.com/article169-page3.html
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| | title = Athlon 64 for Quiet Power | page = 3
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| | date = 2004-06-15 | accessdate = 2013-12-21
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| | author = Mike Chin | publisher = silentpcreview.com
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| | quote = Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate.
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| }}</ref>
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| The TDP is typically not the largest amount of heat the CPU could ever generate, such as by running a [[power virus]], but rather the maximum amount of heat that it would generate when running "real [[application software|applications]]." This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).<ref>{{cite web
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| | url = http://arstechnica.com/gadgets/2013/01/the-technical-details-behind-intels-7-watt-ivy-bridge-cpus/
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| | title = The technical details behind Intel's 7 Watt Ivy Bridge CPUs | |
| | date = 2013-01-14 | accessdate = 2013-01-14
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| | publisher = arstechnica.com
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| | quote = In Intel's case, a specified chip's TDP has less to do with the amount of power a chip needs to use (or can use) and more to do with the amount of power the computer's fan and heatsink need to be able to dissipate while the chip is under sustained load. Actual power usage can be higher or (much) lower than TDP, but the figure is intended to give guidance to engineers designing cooling solutions for their products.
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| }}</ref>
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| == Overview ==
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| In some cases the TDP has been underestimated such that in real applications (typically strenuous, such as video encoding or games) the CPU exceeds the TDP, overloading the computer's cooling system. In this case, the CPU will either cause a system failure (a "therm-trip") or throttle its speed down.<ref>{{cite web
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| | url = http://ixbtlabs.com/articles2/p4-throttling/
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| | title = Testing Thermal Throttling in Pentium 4 CPUs with Northwood and Prescott cores
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| | date = 2004-03-26 | accessdate = 2013-12-21
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| | author = Stanislav Garmatyuk | publisher = ixbtlabs.com
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| }}</ref> Most modern processors will only cause a therm-trip on a catastrophic cooling failure, such as a stuck fan or a loose heatsink.
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| For example, a [[laptop]]'s CPU cooling system may be designed for a 20 [[Watt|W]] TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum [[junction temperature]] for the laptop's CPU. A cooling system can do this using an active cooling method (e.g. forced convection) such as a [[Computer fan|fan]], or any of the three passive cooling methods: [[convection]], [[thermal radiation]] or [[Conduction (heat)|conduction]]. Typically, a combination of these methods is used.
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| Since safety margins and the definition of what constitutes a real application vary among [[Integrated device manufacturer|manufacturers]], TDP values between different manufacturers cannot be accurately compared. For example, while a processor with a TDP of 100 W will almost certainly use more [[electric power|power]] at full load than a processor with a 10 W TDP from the same manufacturer, it may or may not use more power than a processor from a different manufacturer that has a 90 W TDP. Additionally, TDPs are often specified for families of processors, with the low-end models usually using significantly less power than those at the high end of the family.
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| The dynamic power consumed by a switching circuit is approximately proportional to the square of the voltage:<ref>{{cite web
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| | url = ftp://download.intel.com/design/network/papers/30117401.pdf
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| | title = Enhanced Intel SpeedStep Technology for the Intel Pentium M Processor (White Paper)
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| | date = March 2004 | accessdate = 2013-12-21
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| | publisher = [[Intel Corporation]] | format = PDF
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| }}</ref>
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| :<math>P = C V^2 f</math>
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| where {{mvar|C}} is capacitance, {{mvar|f}} is frequency, and {{mvar|V}} is voltage.
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| == {{Anchor|VARIABLE|SDP|NDP|CTDP}}Variable TDP ==
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| ; Configurable TDP (cTDP)
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| : ''cTDP'' (also known as ''programmable TDP'') is an operating mode of later generations of [[Intel]]'s mobile processors ({{As of|2014|January|lc=yes}}), allowing adjustments in their TDP values. By modifying the processor behavior and its performance levels, power consumption of a processor can be changed altering its TDP at the same time. That way, a processor can operate at higher or lower performance levels, depending on the available cooling capacities.<ref name="intel-mh-lines">{{cite web
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| | url = http://www.intel.com/content/dam/www/public/us/en/documents/datasheets/4th-gen-core-family-mobile-m-h-processor-lines-vol-1-datasheet.pdf
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| | title = 4th Generation Intel Core processor based on Mobile M-Processor and H-Processor Lines Datasheet, Volume 1 of 2 | |
| | date = December 2013 | accessdate = 2013-12-22 | |
| | publisher = intel.com | format = PDF | |
| | quote = Configurable TDP (cTDP) and Low-Power Mode (LPM) form a design vector where the processor behavior and package TDP are dynamically adjusted to a desired system performance and power envelope. [...] With cTDP, the processor is now capable of altering the maximum sustained power with an alternate guaranteed frequency. Configurable TDP allows operation in situations where extra cooling is available or situations where a cooler and quieter mode of operation is desired.}}</ref>{{rp|69–72}}
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| : With cTDP, three operating modes are available:<ref name="intel-mh-lines" />{{rp|71–72}}
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| :* ''Nominal TDP''{{snd}} this is the processor's rated frequency and TDP.
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| :* ''cTDP down''{{snd}} when a cooler or quieter mode of operation is desired, this mode specifies a lower TDP and lower guaranteed frequency versus the nominal mode.
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| :* ''cTDP up''{{snd}} when extra cooling is available, this mode specifies a higher TDP and higher guaranteed frequency versus the nominal mode. | |
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| : For example, some of the [[Haswell (microarchitecture)#MOBILE|mobile Haswell]] processors support cTDP up, cTDP down, or both.
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| ; Scenario Design Power (SDP)
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| : ''SDP'' is an operating mode of certain later generations of Intel's mobile processors ({{As of|2014|January|lc=yes}}), allowing them to work at much lower power levels when compared to similar mobile processors not featuring the SDP. They can still exceed SDP and operate at higher power levels under certain workloads and with appropriate cooling capacities provided; for example, they can reach TDP power levels.<ref>{{cite web
| |
| | url = http://arstechnica.com/gadgets/2013/01/the-technical-details-behind-intels-7-watt-ivy-bridge-cpus/
| |
| | title = The technical details behind Intel's 7 Watt Ivy Bridge CPUs
| |
| | date = 2013-01-14 | accessdate = 2013-12-22
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| | publisher = arstechnica.com
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| | quote = If the CPU needs to work hard for an extended period of time and the laptop gets warmer, it will slowly ramp down its speed until it's operating at its stated TDP. [...] There are two OEM-configurable "power level" states that define how quick the CPU can be in these situations: PL2 tells the processor how much power it's allowed to use when it needs a short burst of speed, and PL1 defines how quickly the processor can run under sustained load. [...] This is at the heart of what Intel is doing with the Y-series processors: their maximum TDP has been lowered four watts, from 17 to 13. Intel is also validating them for use at two lower PL1 values: 10 watts and 7 watts. This is where the marketing we discussed earlier comes in—rather than keeping these values under the covers as it has so far been content to do, Intel has taken that lowest value, put it on its product pages, and called it SDP.
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| }}</ref><ref>{{cite web
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| | url = http://www.intel.com/content/dam/www/public/us/en/documents/datasheets/4th-gen-core-family-mobile-u-y-processor-lines-vol-1-datasheet.pdf
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| | title = 4th Generation Intel Core processor based on Mobile U-Processor and Y-Processor Lines Datasheet, Volume 1 of 2
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| | date = December 2013 | accessdate = 2013-12-22
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| | publisher = intel.com | format = PDF
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| }}</ref>{{rp|71}}
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| : For example, [[Haswell (microarchitecture)#MOBILE|Y-series]] (extreme-low power) mobile Haswell processors support SDP.
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| == See also ==
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| * [[CPU power dissipation]]
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| * [[Operating temperature]]
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| == References ==
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| {{Reflist|30em}}
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| {{DEFAULTSORT:Thermal Design Power}}
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| [[Category:Computer engineering]]
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The boy of the , understands perseverance and dedication are key elements in terms of a successful occupation- . His to start with recording, Continue to be Me, produced the very best reaches “All My Girlfriends “Country and Say” Gentleman,” whilst his energy, Doin’ Issue, identified the performer-three directly No. 9 single people: Different Contacting Can be a Very good Point.”
From the tumble of 2011, Tour: Luke And that have an outstanding set billy currington tour of , which includes Downtown. “It’s almost like you are getting a acceptance to travel to the next level, states those performers that were an element of the Concert toursmore than right into a bigger level of artists.” It twisted as one of the best excursions in its twenty-calendar year history.
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